BORON NITRIDE
Boron nitride is a synthetic chemical compound composed of boron and nitrogen atoms, typically found in crystalline forms such as hexagonal Boron nitride (h-BN) and cubic Boron nitride (c-BN), which are isoelectronic with graphite and diamond, respectively.
Hexagonal Boron nitride is a white, lubricating material known as "white graphite," valued for its thermal conductivity, electrical insulation, and high-temperature stability, while cubic Boron nitride is one of the hardest materials, used in cutting tools and abrasives.
Boron nitride’s unique properties, including chemical inertness, resistance to oxidation, and diverse crystalline forms, make it a versatile material with applications in electronics, nanotechnology, cosmetics, and high-performance ceramics.
CAS Number: 10043-11-5
EC Number: 233-136-6
Molecular Formula: BN
Molecular Weight: 24.82 g/mol
Synonyms: Boron nitride, 10043-11-5, azanylidyneborane, Elbor, Boron mononitride, Borazon, Elboron, Kubonit, Wurzin, Geksanit R, Hexanite R, Hexanit R, Super mighty M, Kubonit KR, Denka Boron nitride GP, Elbor R, Denka GP, Elbor RM, Sho BN, Boron nitride (BN), Sho BN HPS, UHP-Ex, SP 1 (Nitride), BN 40SHP, KBN-H10, Elbor LO 10B1-100, Bornitrid, nitrure de bore, nitruro de boro, BZN 550, EINECS 233-136-6, UNII-2U4T60A6YD, Boron nitride Nanotubes, 2U4T60A6YD, DTXSID5051498, CHEBI:50883, EC 233-136-6, MFCD00011317, Boron nitride dispersion, Hexagonal Boron nitride ink, (BN), [BN], white graphite, BN, Nano Boron nitride, Boron nitride powder, Boron nitride 99%, Boron nitride Nanopowder, H-BN, Boron nitride Micropowder, Boron nitride NanoBarbs?, Boron nitride, low binder, H-BN-A, H-BN-B, H-BN-C, 78666-05-4, HEXAGONAL Boron nitride, Hexagonal Boron nitride Powder, Boron nitride Sputtering Target, DTXCID9030046, Boron nitride Powder, 99% Nano, Boron nitride Nanotubes Properties, AKOS015833702, Boron nitride BN GRADE C (H?gan?s), Boron nitride, powder, ~1 mum, 98%, Boron nitride BN GRADE A 01 (H?gan?s), Boron nitride BN GRADE B 50 (H?gan?s), Boron nitride BN GRADE F 15 (H?gan?s), NS00082120, Q/TY. J08.34-2022, Boron nitride Nanotubes (B) Bamboo structure, LUBRIFORM? Boron nitride BN 10 (H?gan?s), LUBRIFORM? Boron nitride BN 15 (H?gan?s), Boron nitride (hBN) Aerosol Spray (13Oz/369g), Boron nitride Nanotubes (C) Cylindrical structure, Q410193, Boron nitride, Refractory Brushable Paint, BN 31%, J-000130, Boron nitride, nanoplatelet, lateral dimensions <5 mu, Boron nitride Rod,Diameter (mm), 12.7,Length (mm), 300, Boron nitride Rod,Diameter (mm), 6.4,Length (mm), 300, Boron nitride, ERM(R) certified Reference Material, powder, Boron nitride Rectangular Plate,Length (mm), 125,Width (mm), 125,Thick (mm), 12.7, Boron nitride Rectangular Plate,Length (mm), 125,Width (mm), 125,Thick (mm), 6.4, Boron nitride, nanopowder, <150 nm avg. part. size (BET), 99% trace metals basis, 174847-14-4
Boron nitride is a synthetic chemical compound composed of boron and nitrogen atoms, typically found in several crystalline forms that resemble carbon structures, such as hexagonal Boron nitride (h-BN) and cubic Boron nitride (c-BN).
Hexagonal Boron nitride, the most stable and commonly encountered form, is a white, lubricating material often referred to as "white graphite" due to its structural and functional similarity to graphite.
Boron nitride is known for its excellent thermal conductivity, electrical insulation, and high-temperature stability, making it a preferred material for applications in electronics, coatings, and high-performance ceramics.
Cubic Boron nitride, on the other hand, is one of the hardest materials known, second only to diamond, and is widely used in cutting tools and abrasives for machining hard materials.
Boron nitride exhibits remarkable chemical inertness, resistance to oxidation, and low density, which contribute to its versatility in harsh environments.
Additionally, emerging applications include its use in nanotechnology, where Boron nitride nanotubes and nanosheets have gained attention for their mechanical strength, thermal stability, and potential in electronic and optical devices.
This unique combination of properties has established Boron nitride as a critical material in diverse industrial, scientific, and technological fields.
Boron nitride is registered under the REACH Regulation and is manufactured in and / or imported to the European Economic Area, at ≥ 100 to < 1 000 tonnes per annum.
Boron nitride is used by consumers, in articles, by professional workers (widespread uses), in formulation or re-packing, at industrial sites and in manufacturing.
Boron nitride is a thermally and chemically resistant refractory compound of boron and nitrogen with the chemical formula Boron nitride.
Boron nitride exists in various crystalline forms that are isoelectronic to a similarly structured carbon lattice.
The hexagonal form corresponding to graphite is the most stable and soft among Boron nitride polymorphs, and is therefore used as a lubricant and an additive to cosmetic products.
The cubic (zincblende aka sphalerite structure) variety analogous to diamond is called c-Boron nitride.
Bron nitride is softer than diamond, but its thermal and chemical stability is superior.
The rare wurtzite Boron nitride modification is similar to lonsdaleite but slightly softer than the cubic form.
Because of excellent thermal and chemical stability, Boron nitride ceramics are used in high-temperature equipment and metal casting.
Boron nitride has potential use in nanotechnology.
The empirical formula of Boron nitride is deceptive.
Boron nitride is not at all like other diatomic molecules such as carbon monoxide (CO) and hydrogen chloride (HCl).
Rather, Boron nitride has much in common with carbon, whose representation as the monatomic C is also misleading.
Boron nitride, like carbon, has multiple structural forms.
Boron nitride’s most stable structure, hBN (shown), is isoelectronic with graphite and has the same hexagonal structure with similar softness and lubricant properties.
hBN can also be produced in graphene-like sheets that can be formed into nanotubes.
In contrast, cubic BN (cBN) is isoelectronic with diamond.
Boron nitride is not quite as hard, but it is more thermally and chemically stable.
Boron nitride is also much easier to make.
Unlike diamond, Boron nitride is insoluble in metals at high temperatures, making it a useful abrasive and oxidation-resistant metal coating.
There is also an amorphous form (aBN), equivalent to amorphous carbon.
Boron nitride is primarily a synthetic material, although a naturally occurring deposit has been reported.
Attempts to make pure Boron nitride date to the early 20th century, but commercially acceptable forms have been produced only in the past 70 years.
In a 1958 patent to the Carborundum Company (Lewiston, NY), Kenneth M. Taylor prepared molded shapes of Boron nitride by heating boric acid (H3BO3) with a metal salt of an oxyacid such as phosphate in the presence of ammonia to form a Boron nitride “mix”, which was then compressed into shape.
Today, similar methods are in use that begin with boric trioxide (B2O3) or H3BO3 and use ammonia or urea as the nitrogen source.
All synthetic methods produce a somewhat impure aBN, which is purified and converted to hBN by heating at temperatures higher than used in the synthesis.
Similarly, to the preparation of synthetic diamond, hBN is converted to cBN under high pressure and temperature.
Boron nitride is a unique ingredient that is widely popular in the personal care and cosmetic industry.
Boron nitride has a white, soft, and powdery appearance, similar to talc.
Boron nitride provides a smooth, silky texture to cosmetic formulations and helps to improve their spreadability and blendability.
Boron nitride can act as a mattifying agent, reducing shine and oiliness on the skin.
Additionally, Boron nitride has excellent thermal conductivity, making it useful in heat-resistant cosmetics.
The chemical formula of Boron nitride is BN.
Boron nitride is a non-toxic thermal and chemical refractory compound with high electrical resistance and low density, commonly found in colorless crystals or white powder.
As an advanced ceramic material, Boron nitride has a unique structure that gives it properties similar to both graphite and diamond, earning it nicknames like "white graphene" or "inorganic graphite."
With its diverse applications and remarkable physical properties, Boron nitride is widely studied and used in industries ranging from electronics to cosmetics.
In this article, we will explore Boron nitride's properties, density, structure, production methods, and uses.
Boron nitride is an advanced synthetic ceramic material available in solid and powder form.
Boron nitride's unique properties – from high heat capacity and outstanding thermal conductivity to easy machinability, lubricity, low dielectric constant, and superior dielectric strength – make Boron nitride a truly outstanding material.
In its solid form, Boron nitride is often referred to as “white graphite” because it has a microstructure similar to that of graphite.
However, unlike graphite, Boron nitride is an excellent electrical insulator that has a higher oxidation temperature.
Boron nitride offers high thermal conductivity and good thermal shock resistance and can be easily machined to close tolerances in virtually any shape.
After machining, Boron nitride is ready for use without additional heat treating or firing operations.
Boron nitride, synthetically produced crystalline compound of boron and nitrogen, an industrial ceramic material of limited but important application, principally in electrical insulators and cutting tools.
Boron nitride is made in two crystallographic forms, hexagonal Boron nitride (H-BN) and cubic Boron nitride (C-BN).
H-BN is prepared by several methods, including the heating of boric oxide (B2O3) with ammonia (NH3).
Boron nitride is a platy powder consisting, at the molecular level, of sheets of hexagonal rings that slide easily past one another.
This structure, similar to that of the carbon mineral graphite, makes H-BN a soft, lubricious material; unlike graphite, though, H-BN is noted for its low electric conductivity and high thermal conductivity.
H-BN is frequently molded and then hot-pressed into shapes such as electrical insulators and melting crucibles.
Boron nitride also can be applied with a liquid binder as a temperature-resistant coating for metallurgical, ceramic, or polymer processing machinery.
C-BN is most often made in the form of small crystals by subjecting H-BN to extremely high pressure (six to nine gigapascals) and temperature (1,500° to 2,000° C, or 2,730° to 3,630° F).
Boron nitride is second only to diamond in hardness (approaching the maximum of 10 on the Mohs hardness scale) and, like synthetic diamond, is often bonded onto metallic or metallic-ceramic cutting tools for the machining of hard steels.
Owing to its high oxidation temperature (above 1,900° C, or 3,450° F), Boron nitride has a much higher working temperature than diamond (which oxidizes above 800° C, or 1,475° F).
Boron nitride is a synthetic material, which although discovered in the early 19th century was not developed as a commercial material until the latter half of the 20th century.
Boron and nitrogen are neighbours of carbon in the periodic table - in combination boron and nitrogen have the same number of outer shell electrons - the atomic radii of boron and nitrogen are similar to that of carbon.
Boron nitride is not surprising therefore that Boron nitride and carbon exhibit similarity in their crystal structure.
In the same way that carbon exists as graphite and diamond, Boron nitride can be synthesised in hexagonal and cubic forms.
The synthesis of hexagonal Boron nitride powder is achieved by nitridation or ammonalysis of boric oxide at elevated temperature.
Cubic Boron nitride is formed by high pressure, high temperature treatment of hexagonal Boron nitride.
Hexagonal Boron nitride (h-BN) is the equivalent in structure of graphite.
Like graphite Boron nitride's plate like microstructure and layered lattice structure give it good lubricating properties.
h-BN is resistant to sintering and is usually formed by hot pressing.
Cubic Boron nitride (C-BN) has the same structure as diamond and its properties mirror those of diamond.
Indeed C-BN is the second hardest material next to diamond.
C-BN was first synthesised in 1957, but Boron nitride is only in the last 15 years that commercial production of C-BN has developed.
Other forms of Boron Nitride:
Hexagonal Boron nitride can be exfoliated to mono or few atomic layer sheets.
Due to Boron nitride's analogous structure to that of graphene, atomically thin Boron nitride is sometimes called white graphene.
Mechanical properties:
Atomically thin Boron nitride is one of the strongest electrically insulating materials.
Monolayer Boron nitride has an average Young's modulus of 0.865TPa and fracture strength of 70.5GPa, and in contrast to graphene, whose strength decreases dramatically with increased thickness, few-layer Boron nitride sheets have a strength similar to that of monolayer Boron nitride.
Thermal conductivity:
Atomically thin Boron nitride has one of the highest thermal conductivity coefficients (751 W/mK at room temperature) among semiconductors and electrical insulators, and Boron nitride's thermal conductivity increases with reduced thickness due to less intra-layer coupling.
Thermal stability:
The air stability of graphene shows a clear thickness dependence: monolayer graphene is reactive to oxygen at 250 °C, strongly doped at 300 °C, and etched at 450 °C; in contrast, bulk graphite is not oxidized until 800 °C.
Atomically thin Boron nitride has much better oxidation resistance than graphene.
Monolayer Boron nitride is not oxidized till 700 °C and can sustain up to 850 °C in air; bilayer and trilayer Boron nitride nanosheets have slightly higher oxidation starting temperatures.
The excellent thermal stability, high impermeability to gas and liquid, and electrical insulation make atomically thin Boron nitride potential coating materials for preventing surface oxidation and corrosion of metals and other two-dimensional (2D) materials, such as black phosphorus.
Better surface adsorption:
Atomically thin Boron nitride has been found to have better surface adsorption capabilities than bulk hexagonal Boron nitride.
According to theoretical and experimental studies, atomically thin Boron nitride as an adsorbent experiences conformational changes upon surface adsorption of molecules, increasing adsorption energy and efficiency.
The synergic effect of the atomic thickness, high flexibility, stronger surface adsorption capability, electrical insulation, impermeability, high thermal and chemical stability of Boron nitride nanosheets can increase the Raman sensitivity by up to two orders, and in the meantime attain long-term stability and reusability not readily achievable by other materials.
Dielectric properties:
Atomically thin hexagonal Boron nitride is an excellent dielectric substrate for graphene, molybdenum disulfide (MoS2), and many other 2D material-based electronic and photonic devices.
As shown by electric force microscopy (EFM) studies, the electric field screening in atomically thin Boron nitride shows a weak dependence on thickness, which is in line with the smooth decay of electric field inside few-layer Boron nitride revealed by the first-principles calculations.
Raman characteristics:
Raman spectroscopy has been a useful tool to study a variety of 2D materials, and the Raman signature of high-quality atomically thin Boron nitride was first reported by Gorbachev et al. in 2011. and Li et al.
However, the two reported Raman results of monolayer Boron nitride did not agree with each other.
Cai et al., therefore, conducted systematic experimental and theoretical studies to reveal the intrinsic Raman spectrum of atomically thin Boron nitride.
Boron nitride reveals that atomically thin Boron nitride without interaction with a substrate has a G band frequency similar to that of bulk hexagonal Boron nitride, but strain induced by the substrate can cause Raman shifts.
Nevertheless, the Raman intensity of G band of atomically thin Boron nitride can be used to estimate layer thickness and sample quality.
Boron nitride nanomesh:
Boron nitride nanomesh is a nanostructured two-dimensional material.
Boron nitride consists of a single Boron nitride layer, which forms by self-assembly a highly regular mesh after high-temperature exposure of a clean rhodium or ruthenium surface to borazine under ultra-high vacuum.
The nanomesh looks like an assembly of hexagonal pores.
The distance between two pore centers is 3.2 nm and the pore diameter is ~2 nm.
Other terms for this material are boronitrene or white graphene.
The Boron nitride nanomesh is air-stable and compatible with some liquids. up to temperatures of 800 °C.
Boron nitride nanotubes:
Boron nitride tubules were first made in 1989 by Shore and Dolan This work was patented in 1989 and published in 1989 thesis (Dolan) and then 1993 Science.
The 1989 work was also the first preparation of amorphous Boron nitride by B-trichloroborazine and cesium metal.
Boron nitride nanotubes were predicted in 1994 and experimentally discovered in 1995.
They can be imagined as a rolled up sheet of h-Boron nitride.
Structurally, Boron nitride is a close analog of the carbon nanotube, namely a long cylinder with diameter of several to hundred nanometers and length of many micrometers, except carbon atoms are alternately substituted by nitrogen and boron atoms.
However, the properties of Boron nitride nanotubes are very different: whereas carbon nanotubes can be metallic or semiconducting depending on the rolling direction and radius, a Boron nitride nanotube is an electrical insulator with a bandgap of ~5.5 eV, basically independent of tube chirality and morphology.
In addition, a layered Boron nitride structure is much more thermally and chemically stable than a graphitic carbon structure.
Boron nitride aerogel:
Boron nitride aerogel is an aerogel made of highly porous Boron nitride.
Boron nitride typically consists of a mixture of deformed Boron nitride nanotubes and nanosheets.
Boron nitride can have a density as low as 0.6 mg/cm3 and a specific surface area as high as 1050 m2/g, and therefore has potential applications as an absorbent, catalyst support and gas storage medium.
Boron nitride aerogels are highly hydrophobic and can absorb up to 160 times their weight in oil.
They are resistant to oxidation in air at temperatures up to 1200 °C, and hence can be reused after the absorbed oil is burned out by flame.
Boron nitride aerogels can be prepared by template-assisted chemical vapor deposition using borazine as the feed gas.
Composites containing Boron nitride:
Addition of Boron nitride to silicon nitride ceramics improves the thermal shock resistance of the resulting material.
For the same purpose, Boron nitride is added also to silicon nitride-alumina and titanium nitride-alumina ceramics.
Other materials being reinforced with Boron nitride include alumina and zirconia, borosilicate glasses, glass ceramics, enamels, and composite ceramics with titanium boride-Boron nitride, titanium boride-aluminium nitride-Boron nitride, and silicon carbide-Boron nitride composition.
Zirconia Stabilized Boron nitride (ZSBN) is produced by adding zirconia to Boron nitride, enhancing Boron nitride's thermal shock resistance and mechanical strength through a sintering process.
Boron nitride offers better performance characteristics including Superior corrosion and erosion resistance over a wide temperature range.
Boron nitride's unique combination of thermal conductivity, lubricity, mechanical strength, and stability makes it suitable for various applications including cutting tools and wear-resistant coatings, thermal and electrical insulation, aerospace and defense, and high-temperature components.
Pyrolytic Boron nitride (PBN):
Pyrolytic Boron nitride (PBN), also known as Chemical vapour-deposited Boron nitride(CVD-BN), is a high-purity ceramic material characterized by exceptional chemical resistance and mechanical strength at high temperatures.
Pyrolytic Boron nitride is typically prepared through the thermal decomposition of boron trichloride and ammonia vapors on graphite substrates at 1900°C.
Pyrolytic Boron nitride (PBN) generally has a hexagonal structure similar to hexagonal Boron nitride (hBN), though it can exhibit stacking faults or deviations from the ideal lattice.
Pyrolytic Boron nitride (PBN) shows some remarkable attributes, including exceptional chemical inertness, high dielectric strength, excellent thermal shock resistance, non-wettability, non-toxicity, oxidation resistance, and minimal outgassing.
Due to a highly ordered planar texture similar to pyrolytic graphite (PG), Boron nitride exhibits anisotropic properties such as lower dielectric constant vertical to the crystal plane and higher bending strength along the crystal plane.
PBN material has been widely manufactured as crucibles of compound semiconductor crystals, output windows and dielectric rods of traveling-wave tubes, high-temperature jigs and insulator.
Uses of Boron Nitride:
Boron nitride's unique structure and density enable it to serve a wide range of applications across multiple industries.
Boron nitride's versatility stems from its various crystalline forms, including hexagonal Boron nitride (h-BN), cubic Boron nitride (c-BN), and wurtzite Boron nitride (w-BN).
These forms collectively contribute to Boron nitride's exceptional performance in challenging environments.
Below are the key applications of Boron nitride.
Industrial and Manufacturing:
Boron nitride is widely used in cutting and grinding tools for hard materials such as hardened steel and wear-resistant cast iron, thanks to its high hardness and chemical stability.
Boron nitride's thermal conductivity and resistance to molten metals make it a preferred material in high-temperature furnaces, vacuum systems, and thermal spraying applications.
Electronics and Optics:
The material's low dielectric constant, excellent thermal stability, and electrical insulation properties make it suitable for use in semiconductor heat sinks and as a substrate material for graphene-based devices.
In the optics industry, Boron nitride's ability to resist oxidation and its high thermal conductivity enable its application in advanced optical coatings and electronics.
Automotive and Aerospace:
Hexagonal Boron nitride is commonly used for creating seals and insulating components in the automotive industry, such as oxygen sensors and thermal shields.
Boron nitride's lightweight density and structure contribute to its use in aerospace materials where weight reduction and thermal resistance are critical.
Cosmetics and Medical:
Boron nitride’s lubricious nature and non-toxicity make it ideal for cosmetics, including eye shadows, foundations, and lipsticks, where it improves smoothness and spreadability.
Emerging research suggests potential applications in the biomedical field, such as implants and biocompatible coatings.
Other Applications:
Boron nitride is frequently used in the production of coatings for tools and molds to enhance their wear resistance.
Boron nitride also finds applications in ceramics, paints, resins, and high-performance alloys.
Applications
Boron nitride is truly a versatile ingredient that finds many different applications in the cosmetic and skin care industry.
Cosmetic products:
Boron nitride is used as a filler and binder, helping to improve the texture and adherence of powders, eyeshadows, and foundations.
Boron nitride imparts a smooth and velvety feel to makeup products, enhancing their blendability and preventing caking or clumping.
Boron nitride also acts as a light-scattering agent, diffusing light to minimize the appearance of fine lines and imperfections, giving the skin a soft-focus effect
Skin care:
Boron nitride is utilized for its oil-absorbing properties.
Boron nitride can help control excess sebum and reduce shine, making it suitable for products targeting oily or combination skin.
Boron nitride is also known for its high thermal conductivity, allowing it to dissipate heat effectively.
This makes Boron nitride useful in products like heat-resistant sunscreens or creams, providing a cooling sensation upon application
Electrical insulators:
The combination of high dielectric breakdown strength and volume resistivity lead to h-BN being used as an electrical insulator however its’ tendency to oxidise at high temperatures often restrict its use to vacuum and inert atmosphere operation.
Crucibles and reaction vessles:
Boron nitride's chemical inertness leads to application as thermocouple protection sheaths, crucibles and linings for reaction vessels though as above oxidation must be avoided.
Moulds and evaporating boats:
h-BN is used in bulk form or as a coating for refractory moulds used in glass forming and in superplastic forming of titanium.
Boron nitride is also used as a constituent in composite materials e.g. TiB2/BN composites for metal evaporation boats, and Si3N4/BN for break rings in continuous casting of steel.
Hot isostatic pressing:
Boron nitride's refractoriness combined with the fact that it is not wetted by molten glass lead to h-BN being used in the production of hot isostatically pressed (HIP’ed) material, most notable ceramics.
In this application preformed parts are coated in h-BN prior to glass encapsulation and HIP’ing.
This protects the part being HIP’ed from actually coming into contact with the glass, which in turn makes it easier to remove after HIP’ing.
Machine cutting tools and abrasives:
Cutting tools and abrasive components particularly for use with low carbon ferrous metals have been developed using C-BN.
In this application the tools behave in a similar manner to polycrystalline diamond tools but can be used on iron and low carbon alloys without risk of reaction.
Substrates for electronic devices:
C-BN is used for substrates for mounting high density and high power electronic components where the high thermal conductivity achieved allows efficient heat dissipation.
Wear resistant coatings:
Due to Boron nitride's high hardness and excellent wear resistant properties, coatings of C-BN have been developed.
Hexagonal BN:
Hexagonal BN (h-BN) is the most widely used polymorph.
Boron nitride is a good lubricant at both low and high temperatures (up to 900 °C, even in an oxidizing atmosphere).
h-BN lubricant is particularly useful when the electrical conductivity or chemical reactivity of graphite (alternative lubricant) would be problematic.
In internal combustion engines, where graphite could be oxidized and turn into carbon sludge, h-BN with its superior thermal stability can be added to engine lubricants.
As with all nano-particle suspensions, Brownian-motion settlement is a problem.
Settlement can clog engine oil filters, which limits solid lubricant applications in a combustion engine to automotive racing, where engine re-building is common.
Since carbon has appreciable solubility in certain alloys (such as steels), which may lead to degradation of properties, Boron nitride is often superior for high temperature and/or high pressure applications.
Another advantage of h-BN over graphite is that Boron nitride's lubricity does not require water or gas molecules trapped between the layers.
Therefore, h-BN lubricants can be used in vacuum, such as space applications.
The lubricating properties of fine-grained h-BN are used in cosmetics, paints, dental cements, and pencil leads.
Hexagonal Boron nitride was first used in cosmetics around 1940 in Japan.
Because of Boron nitride's high price, h-BN was abandoned for this application.
Boron nitride's use was revitalized in the late 1990s with the optimization h-BN production processes, and currently h-BN is used by nearly all leading producers of cosmetic products for foundations, make-up, eye shadows, blushers, kohl pencils, lipsticks and other skincare products.
Because of its excellent thermal and chemical stability, Boron nitride ceramics and coatings are used high-temperature equipment.
h-BN can be included in ceramics, alloys, resins, plastics, rubbers, and other materials, giving them self-lubricating properties.
Such materials are suitable for construction of e.g. bearings and in steelmaking.
Many quantum devices use multilayer h-BN as a substrate material.
Boron nitride can also be used as a dielectric in resistive random access memories.
Hexagonal Boron nitride is used in xerographic process and laser printers as a charge leakage barrier layer of the photo drum.
In the automotive industry, h-BN mixed with a binder (boron oxide) is used for sealing oxygen sensors, which provide feedback for adjusting fuel flow.
The binder utilizes the unique temperature stability and insulating properties of h-BN.
Parts can be made by hot pressing from four commercial grades of h-BN.
Grade HBN contains a boron oxide binder; Boron nitride is usable up to 550–850 °C in oxidizing atmosphere and up to 1600 °C in vacuum, but due to the boron oxide content is sensitive to water.
Grade HBR uses a calcium borate binder and is usable at 1600 °C.
Grades HBC and HBT contain no binder and can be used up to 3000 °C.
Boron nitride nanosheets (h-BN) can be deposited by catalytic decomposition of borazine at a temperature ~1100 °C in a chemical vapor deposition setup, over areas up to about 10 cm2.
Owing to their hexagonal atomic structure, small lattice mismatch with graphene (~2%), and high uniformity they are used as substrates for graphene-based devices.
Boron nitride nanosheets are also excellent proton conductors.
Their high proton transport rate, combined with the high electrical resistance, may lead to applications in fuel cells and water electrolysis.
h-BN has been used since the mid-2000s as a bullet and bore lubricant in precision target rifle applications as an alternative to molybdenum disulfide coating, commonly referred to as "moly".
Boron nitride is claimed to increase effective barrel life, increase intervals between bore cleaning and decrease the deviation in point of impact between clean bore first shots and subsequent shots.
h-BN is used as a release agent in molten metal and glass applications.
For example, ZYP Coatings developed and currently produces a line of paintable h-BN coatings that are used by manufacturers of molten aluminium, non-ferrous metal, and glass.
Because h-BN is nonwetting and lubricious to these molten materials, the coated surface (i.e. mold or crucible) does not stick to the material.
Cubic Boron nitride:
Cubic Boron nitride (CBN or c-BN) is widely used as an abrasive.
Boron nitride's usefulness arises from its insolubility in iron, nickel, and related alloys at high temperatures, whereas diamond is soluble in these metals.
Polycrystalline c-BN (PCBN) abrasives are therefore used for machining steel, whereas diamond abrasives are preferred for aluminum alloys, ceramics, and stone.
When in contact with oxygen at high temperatures, BN forms a passivation layer of boron oxide.
Boron nitride binds well with metals due to formation of interlayers of metal borides or nitrides.
Materials with cubic Boron nitride crystals are often used in the tool bits of cutting tools.
For grinding applications, softer binders such as resin, porous ceramics and soft metals are used.
Ceramic binders can be used as well.
Commercial products are known under names "Borazon" (by Hyperion Materials & Technologies), and "Elbor" or "Cubonite" (by Russian vendors).
Contrary to diamond, large c-BN pellets can be produced in a simple process (called sintering) of annealing c-BN powders in nitrogen flow at temperatures slightly below the Boron nitride decomposition temperature.
This ability of c-BN and h-BN powders to fuse allows cheap production of large Boron nitride parts.
Similar to diamond, the combination in c-BN of highest thermal conductivity and electrical resistivity is ideal for heat spreaders.
As cubic Boron nitride consists of light atoms and is very robust chemically and mechanically, Boron nitride is one of the popular materials for X-ray membranes: low mass results in small X-ray absorption, and good mechanical properties allow usage of thin membranes, further reducing the absorption.
Amorphous Boron nitride:
Layers of amorphous Boron nitride (a-BN) are used in some semiconductor devices, e.g. MOSFETs.
They can be prepared by chemical decomposition of trichloroborazine with caesium, or by thermal chemical vapor deposition methods.
Thermal CVD can be also used for deposition of h-BN layers, or at high temperatures, c-BN.
Uses at industrial sites:
Boron nitride is used in the following products: lubricants and greases, metal working fluids, polymers, metal surface treatment products, coating products, non-metal-surface treatment products, fillers, putties, plasters, modelling clay, hydraulic fluids, inks and toners, laboratory chemicals, paper chemicals and dyes and welding & soldering products.
Boron nitride has an industrial use resulting in manufacture of another substance (use of intermediates).
Boron nitride is used in the following areas: formulation of mixtures and/or re-packaging and building & construction work.
Boron nitride is used for the manufacture of: mineral products (e.g. plasters, cement), machinery and vehicles, plastic products, fabricated metal products, wood and wood products, pulp, paper and paper products, rubber products and furniture.
Release to the environment of Boron nitride can occur from industrial use: in processing aids at industrial sites, in the production of articles, as an intermediate step in further manufacturing of another substance (use of intermediates), as processing aid and of substances in closed systems with minimal release.
Industry Uses:
Lubricating agent
Anti-adhesive agents
Dehydrating agent (desiccant)
Fillers
Other (specify)
Lubricants and lubricant additives
Tanning agents not otherwise specified
Consumer Uses:
Boron nitride is used in the following products: lubricants and greases and cosmetics and personal care products.
Other release to the environment of Boron nitride is likely to occur from: indoor use as processing aid, outdoor use as processing aid, indoor use in close systems with minimal release (e.g. cooling liquids in refrigerators, oil-based electric heaters) and outdoor use in close systems with minimal release (e.g. hydraulic liquids in automotive suspension, lubricants in motor oil and break fluids).
Other:
Filler
Lubricating agent
Heat transferring agent
Fillers
Adhesion/cohesion promoter
Sealant (barrier)
Widespread uses by professional workers:
Boron nitride is used in the following products: lubricants and greases, hydraulic fluids and metal working fluids.
Boron nitride is used in the following areas: scientific research and development.
Release to the environment of Boron nitride can occur from industrial use: in the production of articles.
Other release to the environment of Boron nitride is likely to occur from: indoor use as processing aid, outdoor use as processing aid, indoor use in close systems with minimal release (e.g. cooling liquids in refrigerators, oil-based electric heaters) and outdoor use in close systems with minimal release (e.g. hydraulic liquids in automotive suspension, lubricants in motor oil and break fluids).
Properties of Boron Nitride:
Physical Properties:
The partly ionic structure of Boron nitride layers in h-BN reduces covalency and electrical conductivity, whereas the interlayer interaction increases resulting in higher hardness of h-BN relative to graphite.
The reduced electron-delocalization in hexagonal-BN is also indicated by Boron nitride's absence of color and a large band gap.
Very different bonding – strong covalent within the basal planes (planes where boron and nitrogen atoms are covalently bonded) and weak between them – causes high anisotropy of most properties of h-BN.
For example, the hardness, electrical and thermal conductivity are much higher within the planes than perpendicular to them.
On the contrary, the properties of c-BN and w-BN are more homogeneous and isotropic.
Those materials are extremely hard, with the hardness of bulk c-BN being slightly smaller and w-BN even higher than that of diamond.
Polycrystalline c-BN with grain sizes on the order of 10 nm is also reported to have Vickers hardness comparable or higher than diamond.
Because of much better stability to heat and transition metals, c-BN surpasses diamond in mechanical applications, such as machining steel.
The thermal conductivity of Boron nitride is among the highest of all electric insulators.
Boron nitride can be doped p-type with beryllium and n-type with boron, sulfur, silicon or if co-doped with carbon and nitrogen.
Both hexagonal and cubic Boron nitride are wide-gap semiconductors with a band-gap energy corresponding to the UV region.
If voltage is applied to h-BN or c-BN, then it emits UV light in the range 215–250 nm and therefore can potentially be used as light-emitting diodes (LEDs) or lasers.
Little is known on melting behavior of Boron nitride.
Boron nitride degrades at 2973 °C, but melts at elevated pressure.
Thermal stability:
Hexagonal and cubic Boron nitride (and probably w-BN) show remarkable chemical and thermal stabilities.
For example, h-BN is stable to decomposition at temperatures up to 1000 °C in air, 1400 °C in vacuum, and 2800 °C in an inert atmosphere.
hermal stability of c-BN can be summarized as follows:
In air or oxygen: B2O3 protective layer prevents further oxidation to ~1300 °C; no conversion to hexagonal form at 1400 °C.
In nitrogen: some conversion to h-BN at 1525 °C after 12 h.
In vacuum (10−5 Pa): conversion to h-BN at 1550–1600 °C.
Chemical stability:
Boron nitride is not attacked by the usual acids, but it is soluble in alkaline molten salts and nitrides, such as LiOH, KOH, NaOH-Na2CO3, NaNO3, Li3N, Mg3N2, Sr3N2, Ba3N2 or Li3BN2, which are therefore used to etch Boron nitride.
Thermal conductivity:
The theoretical thermal conductivity of hexagonal Boron nitride nanoribbons (BNNRs) can approach 1700–2000 W/(m⋅K), which has the same order of magnitude as the experimental measured value for graphene, and can be comparable to the theoretical calculations for graphene nanoribbons.
Moreover, the thermal transport in the BNNRs is anisotropic.
The thermal conductivity of zigzag-edged BNNRs is about 20% larger than that of armchair-edged nanoribbons at room temperature.
Mechanical properties:
Boron nitride nanosheets consist of hexagonal Boron nitride (h-BN).
They are stable up to 800°C in air.
The structure of monolayer Boron nitride is similar to that of graphene, which has exceptional strength, a high-temperature lubricant, and a substrate in electronic devices.
The anisotropy of Young's modulus and Poisson's ratio depends on the system size.
h-BN also exhibits strongly anisotropic strength and toughness, and maintains these over a range of vacancy defects, showing that the anisotropy is independent to the defect type.
Natural occurrence of Boron Nitride:
In 2009, cubic form (c-BN) was reported in Tibet, and the name qingsongite proposed.
Boron nitride was found in dispersed micron-sized inclusions in chromium-rich rocks.
In 2013, the International Mineralogical Association affirmed the mineral and the name.
Synthesis of Boron Nitride:
Preparation and reactivity of hexagonal Boron nitride:
Hexagonal Boron nitride is obtained by the treating boron trioxide (B2O3) or boric acid (H3BO3) with ammonia (NH3) or urea (CO(NH2)2) in an inert atmosphere:
B2O3 + 2 NH3 → 2 BN + 3 H2O (T = 900 °C)
B(OH)3 + NH3 → BN + 3 H2O (T = 900 °C)
B2O3 + CO(NH2)2 → 2 BN + CO2 + 2 H2O (T > 1000 °C)
B2O3 + 3 CaB6 + 10 N2 → 20 BN + 3 CaO (T > 1500 °C)
The resulting disordered (amorphous) material contains 92–95% Boron nitride and 5–8% B2O3.
The remaining B2O3 can be evaporated in a second step at temperatures > 1500 °C in order to achieve Boron nitride concentration >98%.
Such annealing also crystallizes Boron nitride, the size of the crystallites increasing with the annealing temperature.
h-BN parts can be fabricated inexpensively by hot-pressing with subsequent machining.
The parts are made from Boron nitride powders adding boron oxide for better compressibility.
Thin films of Boron nitride can be obtained by chemical vapor deposition from boron trichloride and nitrogen precursors.
ZYP Coatings also has developed Boron nitride coatings that may be painted on a surface.
Combustion of boron powder in nitrogen plasma at 5500 °C yields ultrafine Boron nitride used for lubricants and toners.
Boron nitride reacts with iodine fluoride to give NI3 in low yield.
Boron nitride reacts with nitrides of lithium, alkaline earth metals and lanthanides to form nitridoborates.
For example:
Li3N + BN → Li3BN2
Intercalation of hexagonal Boron nitride:
Various species intercalate into hexagonal Boron nitride, such as NH3 intercalate or alkali metals.
Preparation of cubic Boron nitride:
c-BN is prepared analogously to the preparation of synthetic diamond from graphite.
Direct conversion of hexagonal Boron nitride to the cubic form has been observed at pressures between 5 and 18 GPa and temperatures between 1730 and 3230 °C, that is similar parameters as for direct graphite-diamond conversion.
The addition of a small amount of boron oxide can lower the required pressure to 4–7 GPa and temperature to 1500 °C.
As in diamond synthesis, to further reduce the conversion pressures and temperatures, a catalyst is added, such as lithium, potassium, or magnesium, their nitrides, their fluoronitrides, water with ammonium compounds, or hydrazine.
Other industrial synthesis methods, again borrowed from diamond growth, use crystal growth in a temperature gradient, or explosive shock wave.
The shock wave method is used to produce material called heterodiamond, a superhard compound of boron, carbon, and nitrogen.
Low-pressure deposition of thin films of cubic Boron nitride is possible.
As in diamond growth, the major problem is to suppress the growth of hexagonal phases (h-BN or graphite, respectively).
Whereas in diamond growth this is achieved by adding hydrogen gas, boron trifluoride is used for c-BN.
Ion beam deposition, plasma-enhanced chemical vapor deposition, pulsed laser deposition, reactive sputtering, and other physical vapor deposition methods are used as well.
Preparation of wurtzite Boron nitride:
Wurtzite Boron nitride can be obtained via static high-pressure or dynamic shock methods.
The limits of Boron nitride's stability are not well defined.
Both c-BN and w-BN are formed by compressing h-BN, but formation of w-BN occurs at much lower temperatures close to 1700 °C.
Production statistics:
Whereas the production and consumption figures for the raw materials used for Boron nitride synthesis, namely boric acid and boron trioxide, are well known (see boron), the corresponding numbers for the Boron nitride are not listed in statistical reports.
An estimate for the 1999 world production is 300 to 350 metric tons.
The major producers and consumers of Boron nitride are located in the United States, Japan, China and Germany.
In 2000, prices varied from about $75–120/kg for standard industrial-quality h-BN and were about up to $200–400/kg for high purity Boron nitride grades.
Structure of Boron Nitride:
Boron nitride exists in multiple forms that differ in the arrangement of the boron and nitrogen atoms, giving rise to varying bulk properties of the material.
Amorphous form (a-BN)
The amorphous form of Boron nitride (a-BN) is non-crystalline, lacking any long-distance regularity in the arrangement of its atoms.
Boron nitride is analogous to amorphous carbon.
All other forms of Boron nitride are crystalline.
Hexagonal form (h-BN)
The most stable crystalline form is the hexagonal one, also called h-BN, α-BN, g-BN, and graphitic Boron nitride.
Hexagonal Boron nitride (point group = D3h; space group = P63/mmc) has a layered structure similar to graphite.
Within each layer, boron and nitrogen atoms are bound by strong covalent bonds, whereas the layers are held together by weak van der Waals forces.
The interlayer "registry" of these sheets differs, however, from the pattern seen for graphite, because the atoms are eclipsed, with boron atoms lying over and above nitrogen atoms.
This registry reflects the local polarity of the B–N bonds, as well as interlayer N-donor/B-acceptor characteristics.
Likewise, many metastable forms consisting of differently stacked polytypes exist.
Therefore, h-BN and graphite are very close neighbors, and the material can accommodate carbon as a substituent element to form BNCs.
BC6N hybrids have been synthesized, where carbon substitutes for some B and N atoms.
Hexagonal Boron nitride monolayer is analogous to graphene, having a honeycomb lattice structure of nearly the same dimensions.
Unlike graphene, which is black and an electrical conductor, h-BN monolayer is white and an insulator.
Boron nitride has been proposed for use as an atomic flat insulating substrate or a tunneling dielectric barrier in 2D electronics.
Cubic form (c-BN):
Cubic Boron nitride has a crystal structure analogous to that of diamond.
Consistent with diamond being less stable than graphite, the cubic form is less stable than the hexagonal form, but the conversion rate between the two is negligible at room temperature, as it is for diamond.
The cubic form has the sphalerite crystal structure (space group = F43m), the same as that of diamond (with ordered B and N atoms), and is also called β-BN or c-BN.
Wurtzite form (w-BN)
The wurtzite form of Boron nitride (w-BN; point group = C6v; space group = P63mc) has the same structure as lonsdaleite, a rare hexagonal polymorph of carbon.
As in the cubic form, the boron and nitrogen atoms are grouped into tetrahedra.
In the wurtzite form, the boron and nitrogen atoms are grouped into 6-membered rings.
In the cubic form all rings are in the chair configuration, whereas in w-BN the rings between 'layers' are in boat configuration.
Earlier optimistic reports predicted that the wurtzite form was very strong, and was estimated by a simulation as potentially having a strength 18% stronger than that of diamond.
Since only small amounts of the mineral exist in nature, this has not yet been experimentally verified.
Boron nitride's hardness is 46 GPa, slightly harder than commercial borides but softer than the cubic form of Boron nitride.
General Manufacturing Information of Boron Nitride:
Industry Processing Sectors:
Plastics Material and Resin Manufacturing
Primary Metal Manufacturing
Computer and Electronic Product Manufacturing
Plastics Product Manufacturing
Other (requires additional information)
Paint and Coating Manufacturing
Transportation Equipment Manufacturing
All Other Basic Inorganic Chemical Manufacturing
Miscellaneous Manufacturing
History of Boron Nitride:
The history of Boron nitride (BN) dates back to the mid-19th century, when it was first synthesized in 1842 by the reaction of boric acid with potassium cyanide, though its practical applications were not realized until much later.
For decades, Boron nitride remained a laboratory curiosity until advancements in material science during the 20th century highlighted its unique properties.
The development of hexagonal Boron nitride (h-BN) as a lubricant and high-temperature insulator gained momentum in the 1940s and 1950s, particularly for use in aerospace and defense industries.
In 1957, cubic Boron nitride (c-BN) was first synthesized by subjecting h-BN to high pressure and temperature, a breakthrough that positioned it as a key industrial material due to its hardness and wear resistance, rivaling that of diamond.
The later discovery of Boron nitride nanotubes (BNNTs) in 1995 and subsequent research into two-dimensional Boron nitride sheets sparked significant interest in nanotechnology and advanced materials.
Today, Boron nitride’s history reflects its evolution from a simple compound to a versatile material critical to applications in electronics, manufacturing, and scientific innovation.
Handling and Storage of Boron Nitride:
Boron nitride should be handled with care to minimize dust formation and inhalation.
Store it in a cool, dry, and well-ventilated area, away from incompatible materials like strong acids, alkalis, and oxidizers.
Keep containers tightly sealed and protected from physical damage.
Avoid direct exposure to moisture to maintain the material's stability.
Reactivity and Stability of Boron Nitride:
Boron nitride is chemically stable under normal conditions of use and storage.
It is resistant to oxidation and does not react with most acids, bases, or organic solvents.
However, it can react with strong oxidizing agents under high temperatures.
Hexagonal Boron nitride is thermally stable, while cubic Boron nitride can decompose at extremely high temperatures.
No hazardous polymerization is expected.
First Aid Measures of Boron Nitride:
Inhalation:
If inhaled, move the affected individual to fresh air.
If breathing is difficult, administer oxygen and seek medical attention.
Skin Contact:
Wash the affected area with soap and water.
Remove contaminated clothing.
Seek medical advice if irritation persists.
Eye Contact:
Rinse eyes immediately with plenty of water for at least 15 minutes.
Remove contact lenses if present and easy to do.
Seek medical attention if irritation continues.
Ingestion:
Rinse the mouth with water.
Do not induce vomiting unless directed by medical personnel.
Seek medical attention if symptoms occur.
Firefighting Measures of Boron Nitride:
Boron nitride is non-flammable and does not support combustion.
In the event of a fire involving Boron nitride:
Suitable Extinguishing Media:
Use water spray, dry chemical, foam, or carbon dioxide (CO₂) to extinguish surrounding fire.
Protective Equipment:
Firefighters should wear self-contained breathing apparatus (SCBA) and protective clothing to prevent exposure to combustion products.
Hazards:
In a fire, decomposition products such as boron oxides and nitrogen oxides may form.
Accidental Release Measures of Boron Nitride:
Personal Precautions:
Avoid generating dust.
Use appropriate personal protective equipment (PPE), including gloves, safety goggles, and respiratory protection.
Containment and Cleanup:
Sweep up or vacuum material carefully to avoid dispersing dust.
Place in a suitable, labeled container for disposal in accordance with local regulations.
Avoid releasing material into the environment.
Exposure Controls/Personal Protective Equipment of Boron Nitride:
Engineering Controls:
Use local exhaust ventilation or other engineering controls to maintain airborne concentrations below recommended exposure limits.
Personal Protective Equipment:
Respiratory Protection:
Use a NIOSH-approved respirator if exposure limits are exceeded or dust formation occurs.
Eye Protection:
Wear safety goggles or face shields.
Skin Protection:
Use chemical-resistant gloves and protective clothing to minimize contact.
Hygiene Measures:
Wash hands thoroughly after handling and avoid eating, drinking, or smoking in areas where Boron nitride is handled.
Identifiers of Boron Nitride:
CAS Number: 10043-11-5
ChEBI: CHEBI:50883
ChemSpider: 59612
ECHA InfoCard: 100.030.111
EC Number: 233-136-6
Gmelin Reference: 216
MeSH: Elbor
PubChem CID: 66227
RTECS number: ED7800000
UNII: 2U4T60A6YD
CompTox Dashboard (EPA): DTXSID5051498
InChI: InChI=1S/BN/c1-2
Key: PZNSFCLAULLKQX-UHFFFAOYSA-N check
InChI=1S/B2N2/c1-3-2-4-1
Key: AMPXHBZZESCUCE-UHFFFAOYSA-N
InChI=1S/B3N3/c1-4-2-6-3-5-1
Key: WHDCVGLBMWOYDC-UHFFFAOYSA-N
InChI=1/BN/c1-2
Key: PZNSFCLAULLKQX-UHFFFAOYAL
SMILES: B#N
CAS Number: 10043-11-5
Chem/IUPAC Name: Boron nitride
EINECS/ELINCS No: 233-136-6
COSING REF No: 32211
Linear Formula: BN
MDL Number: MFCD00011317
EC No.: 233-136-6
Beilstein/Reaxys No.: N/A
Pubchem CID: 66227
IUPAC Name: azanylidyneborane
SMILES: B#N
InchI Identifier: InChI=1S/BN/c1-2
InchI Key: PZNSFCLAULLKQX-UHFFFAOYSA-N
CAS: 10043-11-5
Molecular Formula: BN
Molecular Weight: (g/mol) 24.82
MDL Number: MFCD00011317
InChI Key: LNLSXDSWJBUPHM-UHFFFAOYSA-N
PubChem CID: 66227
ChEBI: CHEBI:50883
SMILES: B=N
Properties of Boron Nitride:
Chemical formula: BN
Molar mass: 24.82 g/mol
Appearance: Colorless crystals
Density: 2.1 g/cm3 (h-BN); 3.45 g/cm3 (c-BN)
Melting point: 2,973 °C (5,383 °F; 3,246 K) sublimates (c-BN)
Solubility in water: Insoluble
Electron mobility: 200 cm2/(V·s) (c-BN)
Refractive index (nD): 1.8 (h-BN); 2.1 (c-BN)
Compound Formula: BN
Molecular Weight: 24.82
Appearance: Black powder
Melting Point: 2973 °C
Boiling Point: N/A
Density: 2.1 g/cm3 (h-BN); 3.45 g/cm3 (c-BN)
Bulk Density: 0.3 g/cm3
True Density: 2.25 g/cm3
Average Particle Size: ~70 nm
Specific Surface Area: ~20 m2/g
Morphology: nearly spherical
Solubility in H2O: Insoluble
Refractive Index: 1.8 (h-BN); 2.1 (c-BN)
Crystal Phase / Structure: N/A
Electrical Resistivity: 13 to 15 10x Ω-m
Poisson's Ratio: 0.11
Specific Heat: 840 to 1610 J/kg-K
Thermal Conductivity: 29 to 96 W/m-K
Thermal Expansion: 0.54 to 18 µm/m-K
Young's Modulus: 14 to 60 GPa
Molecular Weight: 24.82 g/mol
Hydrogen Bond Donor Count: 0
Hydrogen Bond Acceptor Count: 1
Rotatable Bond Count: 0
Exact Mass: 25.0123792 Da
Monoisotopic Mass: 25.0123792 Da
Topological Polar Surface Area: 23.8Ų
Heavy Atom Count: 2
Complexity: 10
Isotope Atom Count: 0
Defined Atom Stereocenter Count: 0
Undefined Atom Stereocenter Count: 0
Defined Bond Stereocenter Count: 0
Undefined Bond Stereocenter Count: 0
Covalently-Bonded Unit Count: 1
Compound Is Canonicalized: Yes
Specifications of Boron Nitride:
Physical Form: Hot Pressed Rod
Quantity: 1 Pc.
IUPAC Name: azanylidyneborane
Formula Weight: 24.82
Percent Purity: 99.5%
Packaging: Bag
Chemical Name or Material: Boron nitride
Structure of Boron Nitride:
Crystal structure: Hexagonal, sphalerite, wurtzite
Thermochemistry of Boron Nitride:
Heat capacity (C): 19.7 J/(K·mol)
Std molar entropy (S⦵298): 14.8 J/K mol
Std enthalpy of formation (ΔfH⦵298): −254.4 kJ/mol
Gibbs free energy (ΔfG⦵): −228.4 kJ/mol
Related compounds of Boron Nitride:
Boron arsenide
Boron carbide
Boron phosphide
Boron trioxide
Names of Boron Nitride:
Regulatory process names:
Boron nitride
Boron nitride
Boron nitride
IUPAC names:
azanylidyneborane
Boranylidyneamine
boranylidyneamine
Bornitrid
Boron nitride
Boron nitride
Boron nitride
Boron nitride
Boron nitride
Boron(III)nitride
nitriloborane
Other identifiers:
10043-11-5
1361021-23-9
1361021-37-5
165390-92-1
54824-38-3
56939-87-8
58799-13-6
60569-72-4
69071-29-0
69495-08-5
78666-05-4
